prof. dr. ir. Maaike Op de Beeck
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- Journal Article
- A1
- open access
Investigating the nucleation of AlOx and HfOx ALD on polyimide : influence of plasma activation
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- Conference Paper
- C3
- open access
The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation
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Non-thermal plasma activation of BPDA-PPD polyimide for improved cell-material interaction
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- Conference Paper
- C3
- open access
Visualizing the nucleation of ALD on polymers
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- Journal Article
- A1
- open access
Accelerated hermeticity testing of biocompatible moisture barriers used for the encapsulation of implantable medical devices
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Development of an active high-density transverse intrafascicular micro-electrode probe
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Cold plasma activation of BPDA-PPD polyimide for improved biocompatibility
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FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
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- Journal Article
- A1
- open access
Ultra-long-term reliable encapsulation using an atomic layer deposited Hfo2/Al2o3/Hfo2 triple-interlayer for biomedical implants
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Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3
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Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves
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- Conference Paper
- C3
- open access
Accelerated hermeticity testing of biocompatible moisture barriers used for encapsulation of implantable medical devices
(2017) p.1-1 -
Intraneural active probe for bidirectional peripheral nerve interface
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- Conference Paper
- C3
- open access
Polyimide-ald-polyimide layers as hermetic encapsulant for implants
(2017) p.1-6 -
- Conference Paper
- C3
- open access
Superior moisture barrier properties of CMOS passivation stacks by the use of plasma-densified oxides
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- Conference Paper
- C3
- open access
Polymer-based encapsulation materials with optimized diffusion barrier properties for flexible hermetic medical electronics
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A Subcutaneous Biochip for Remote Monitoring of Human Metabolism : Packaging and Biocompatibility Assessment
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Three-Dimensional Transient Thermal Analysis for a Silicon PCR Microreactor
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Electrochemical fabrication of platinum interconnects for implantable electronic devices
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- Journal Article
- A1
- open access
Soft, comfortable polymer dry electrodes for high quality ECG and EEG recording
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Comb-shaped Polymer-based Dry Electrodes for EEG/ECG Measurements with High User Comfort
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Miniaturized pumps and valves, based on conductive polimer actuators, for lab-on-chip application
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Electrodeposition of Platinum Thin Films as Interconnects Material for Implantable Medical Applications
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- Conference Paper
- P1
- open access
Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments
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- Conference Paper
- C3
- open access
One-time deformable electronics
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- Conference Paper
- C3
- open access
Parylene C for hermetic and flexible encapsulation of interconnects and electronic components
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Multi-sensors modules in SiGeMEMS technology
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Photo-definable polyimide-based flat UTCP technology for 3D-stacking application
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Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging
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Biocompatible encapsulation and interconnection technology for implantable electronic devices
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A MICRO-PCR CHAMBER SUITABLE FOR INTEGRATION INTO A MONOLITHIC SILICON LAB-ON-A-CHIP PLATFORM
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Novel Miniaturized Packaging for Implantable Electronic Devices
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Fully Integrated Biochip Platforms for Advanced Healthcare
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Silicon Based System for Single-Nucleotide-Polymorphism Detection: Chip Fabrication and Thermal Characterization of Polymerase Chain Reaction Microchamber
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Miniature conductive polymer actuators for high pressure generation in lab on chip systems
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- Conference Paper
- C1
- open access
Biocompatible packaging solutions for implantable electronic systems for medical applications
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- Conference Paper
- C1
- open access
High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
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Design and characterization of a biocompatible packaging concept for implantable electronic devices
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Development of Cost-effective Biocompatible Packaging for Microelectronic Devices
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Hydrogel Optimization Towards Fibroblast-friendly Biomimetic Coatings for Implantable Devices
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2-Scale Topography Dry Electrode for Biopotential Measurements
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HIGH PRESSURE PUMP AS LAB ON CHIP COMPONENT FOR MICRO-FLUIDIC INTEGRATED SYSTEM
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Sub-micro-liter electrochemical single-nucleotide-polymorphism detector for lab-on-chip system
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An IC-centric biocompatible chip encapsulation fabrication process
(2010) -
Biocompatibility assessment of advanced wafer-level based chip encapsulation
(2010) -
Tuning Electrode Impedance for the Electrical Recording of Biopotentials
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Integrated fluidic
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Design and fabrication of a biomedical Lab-on-Chip system for SNP detection in DNA
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An invisible interface
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Auto-oscillation and narrow spectral lines in spin-torque oscillators based on MgO magnetic tunnel junctions
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Effect of patterning on the saturation magnetization in MgO based nanopillars
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Auto-oscillation threshold and line narrowing in MgO-based spin-torque oscillators
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Integration of 50nm half pitch single damascene copper trenches in Black Diamond (R) II by means of double patterning 193nm immersion lithography on metal hardmask
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30nm half-pitch metal patterning using Motif (TM) CD shrink technique and double patterning - art. no. 69242C
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Novel patterning shrink technique enabling sub-50nm trench and contact integration
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Manufacturability issues with Double Patterning for 50nm half pitch single damascene applications, using RIELACS (R) shrink and corresponding OPC
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A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45nm node applications and beyond - art. no. 65190U
(2007) Advances in Resist Materials and Processing Technology XXIV. In ARRAY(0x91903d8) 6519. p.U5190-U5190 -
Combined illumination sources for hyper-NA contact hole printing
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High and hyper NA immersion lithography using advanced patterning film APF (TM)
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Early learning on hyper-NA lithography using two-beam immersion interference
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CD control using SiON BARL processing for sub-0.25 mu m lithography
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Bottom-ARC optimization methodology for 0.25 mu m lithography and beyond
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Nanoscaled interdigitated electrode arrays for biochemical sensors
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Nanoscaled interdigitated electrode arrays for biochemical sensors
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NA/sigma optimisation strategies for an advanced DUV stepper applied to 0.25 mu m and sub-0.25 mu m critical levels
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Manufacturable DUV lithography processes for 0.25 mu m technology contact and via layers
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DUV resist profile improvement on TiN deposited metal layer
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Characterisation and optimisation of CD control for 0.25 mu m CMOS applications
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Optical proximity effects and correction strategies for chemical amplified DUV resists
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DUV LITHOGRAPHY FOR 0.35-MU-M CMOS PROCESSING
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LITHOGRAPHIC STRATEGIES FOR 0.35-MU-M POLY-GATES FOR RANDOM LOGIC APPLICATIONS
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FUNDAMENTAL PRINCIPLES OF PHASE-SHIFTING MASKS BY FOURIER OPTICS - THEORY AND EXPERIMENTAL-VERIFICATION
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TOPOGRAPHICAL MASKS - A NEW APPROACH TO INCREASE THE DOF ON TOPOGRAPHICAL SUBSTRATES
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A NOVEL PROCESS FOR PHASE-SHIFTING MASK FABRICATION
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INFLUENCE OF SHIFTER ERRORS ON THE PRINTABILITY OF L/S STRUCTURES USING THE ALTERNATED PHASE-SHIFTING DESIGN - SIMULATIONS AND EXPERIMENTS
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DRY DEVELOPMENT OF SURFACE IMAGING RESISTS - A MAJOR PARAMETER FOR PROCESS OPTIMIZATION
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SILYLATION OF NOVOLAC BASED RESISTS - INFLUENCE OF DEEP-ULTRAVIOLET INDUCED CROSS-LINKING
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IMPROVEMENT OF FOCUS AND EXPOSURE LATITUDE BY THE USE OF PHASE-SHIFTING MASKS FOR DUV APPLICATIONS
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Sub-half-micron deep-UV lithography using wet and dry developable resist schemes
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GAS-PHASE SILYLATION IN THE DIFFUSION ENHANCED SILYLATED RESIST PROCESS FOR APPLICATION TO SUB-0.5-MU-M OPTICAL LITHOGRAPHY