Show
Sort by
-
Development of a stretchable circuit and its integration method on knit fabrics for lower back injury prevention
-
- Journal Article
- A1
- open access
PIXAPP photonics packaging pilot line development of a silicon photonic optical transceiver with pluggable fiber connectivity
-
- Journal Article
- A1
- open access
Development and washing reliability testing of a stretchable circuit on knit fabric
-
3D heterogeneous package integration of air/magnetic core inductor : 89% efficiency buck converter with backside power delivery network
-
Integrated magnetic cores in FOWLP and their applications
-
- Conference Paper
- C3
- open access
Technology development for a flexible, low-cost backplane for lighting applications
-
- Conference Paper
- C3
- open access
Technology development for a flexible, low-cost backplane for lighting applications
-
- Journal Article
- A1
- open access
High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages
-
Laboratory validation of MEMS-based sensors for post-earthquake damage assessment
-
- Conference Paper
- C3
- open access
Adhesion test for UTCP structure in humid environment
-
Thin-film based stretchable electronics technologies
-
Multi-sensors modules in SiGeMEMS technology
-
Photo-definable polyimide-based flat UTCP technology for 3D-stacking application
-
Low power wireless sensor network for building monitoring
-
3D stacking of ultrathin chip packages: an innovative packaging and interconnection technology
-
Earthquake assessment of reinforced concrete buildings
-
- Conference Paper
- C1
- open access
Full-scale laboratory validation of a MEMS-based technology for post-earthquake damage assessment
-
- Conference Paper
- P1
- open access
Embedding thinned chips in flexible PCBs
-
- Conference Paper
- P1
- open access
Thinned dies in a stretchable package
-
- Conference Paper
- C1
- open access
High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
-
Solution-processed and low-temperature metal oxide n-channel thin-film transistors and low-voltage complementary circuitry on large-area flexible polyimide foil
-
Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide
-
- Conference Paper
- P1
- open access
An approach to produce a stack of photo definable polyimide based flat UTCPs
-
Sub-micro-liter electrochemical single-nucleotide-polymorphism detector for lab-on-a-chip system
-
Full-scale laboratory validation of a wireless MEMS-based technology for damage assessment of concrete structures
-
- Conference Paper
- C1
- open access
Low power wireless sensor network for structural health monitoring of buildings using MEMS strain sensors and accelerometers
-
Micro to nano integration of intelligent wireless sensors networks for structural meso scale applications
-
Sub-micro-liter electrochemical single-nucleotide-polymorphism detector for lab-on-chip system
-
- Conference Paper
- C1
- open access
Low power wireless sensor network for building monitoring
-
- Conference Paper
- P1
- open access
Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system
-
Low-temperature and low-voltage, solution-processed metal oxide n-TFTs and flexible circuitry on large-area polyimide foil
-
A Reliable and comfortable package for wearable medical devices
-
Cyclic endurance reliability of stretchable electronic substrates
-
Flexible monolithic active pixel sensors embedded in ultra thin polymer film
-
Power processing circuits for piezoelectric vibration-based energy harvesters
-
- Conference Paper
- C1
- open access
Development of a thin-film stretchable electrical interconnection technology for biocompatible applications
-
Thin-film interconnection technology for use in a stretchable cell culture platform
-
Lifetime of stretchable meander-shaped copper conductors in PDMS subjected to cyclic elongation
-
Electrostatic vibration energy harvesters for wireless autonomous transducer systems
-
An electrostatic energy harvester with electret bias
-
Innovative micropower solutions for wireless autonomous sensor nodes
-
- Journal Article
- A1
- open access
Electrostatic microgenerators
-
Fabrication, modelling and characterization of MEMS piezoelectric vibration harvesters
-
- Conference Paper
- C1
- open access
Wireless autonomous transducer solutions for hybrid electrical vehicle applications
-
Characterization of an electrostatic vibration harvester
-
Energy scavengers: modeling and behavior with different load circuits
-
Harvesting energy from vibrations by a micromachined electret generator
-
Piezoelectric harvesters and MEMS technology : fabrication, modeling and measurements
-
A hybrid electrodynamic vibration harvester
-
Energy scavengers for wireless intelligent microsystems
-
Electrostatic energy scavengers for wireless autonomous transducer solutions
-
Motion-based generators for industrial applications
-
Energie am Körper gewinnen
-
Innovative vibrationssensoren
-
Piezoelectric scavengers in MEMS technology : fabrication and simulation
-
Requirements for power electronics used for energy harvesting devices
-
Combining BCB with KOH : wet bulk micromachining versus wafer bonding
-
- Conference Paper
- C1
- open access
Parametrical study of miniature generators for large motion applications
-
Scavenging energy from human body : design of a piezoelectric transducer
-
Un innovativo progetto MEMS per il riutilizzo delle vibrazione ambientali
-
Novel design and fabrication of a MEMS electrostatic vibration scavenger
-
Polymer based wafer bonding for MEMS devices and MEMS packaging
-
Kraftwerk für mobile Sensornetze
-
POWER micro-electro-mechanical systems (MEMS): innovative design for ambient vibration scanvengers
-
Anisotropic etching of silicon using KOH: fast etching planes revisited
-
Comparative modelling for vibration scavengers
-
An electret-based electrostatic µ-generator
-
- Conference Paper
- C1
- open access
A new power MEMS component with variable capacitance
-
- Conference Paper
- C1
- open access
Power extraction from ambient vibration