Wim Christiaens

Show Sort by

Add to list
- Conference Paper
- C1
3D-stacking of UTCPs as a module miniaturization technology

Swarnakamal Priyabadini (UGent) , An Gielen (UGent) , Kristof Dhaenens (UGent) , Wim Christiaens (UGent) , Steven Van Put (UGent) , Gerhard Kunkel, Anders Erik Petersen and Jan Vanfleteren (UGent)

(2011) 44th International Symposium on Microelectronics, Proceedings. p.463-468
Add to list
- Journal Article
- A1
Design and implementation of flexible and stretchable systems

Mario Gonzalez, Bart Vandevelde, Wim Christiaens (UGent) , Yung-Yu Hsu, François Iker, Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Olaf van der Sluis and PHM Timmermans

(2011) MICROELECTRONICS RELIABILITY. 51(6). p.1069-1076
Add to list
- Conference Paper
- C3
A Reliable and comfortable package for wearable medical devices

Tom Sterken (UGent) , Jan Vanfleteren (UGent) , Frederick Bossuyt (UGent) , Steven Brebels, Wim Christiaens (UGent) , Thomas Vervust (UGent) , Michal Jablonski (UGent) , Sheila Dunphy (UGent) , Filip Vermeiren (UGent) , Yung-yu Hsu, et al.

(2011) Microelectronic packaging for medical and Hi-Rel devices, Abstracts.
Add to list
- Book Chapter
System-in-foil technology

Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren (UGent) , Wim Christiaens (UGent) , Erwin Bosman (UGent) and Johan De Baets (UGent)

(2011) Ultra-thin chip technology and applications. p.141-157
Add to list
- Conference Paper
- C1
Module miniaturization by ultra thin package stacking

Thomas Loeher, David Schuetze, Wim Christiaens (UGent) , Kristof Dhaenens (UGent) , Swarnakamal Priyabadini (UGent) , Andreas Ostmann and Jan Vanfleteren (UGent)

(2010) 2010 3rd electronic system-integration technology conference (ESTC 2010). p.1-5
Add to list
- Journal Article
- A1
UTCP: a novel polyimide-based ultra-thin chip packaging technology

Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)

(2010) IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. 33(4). p.754-760
Add to list
- Conference Paper
- C1
- open access
Thermo-mechanical analysis of flexible and stretchable systems

Mario Gonzalez, Bart Vandevelde, Wim Christiaens (UGent) , Yung Yu Hsu, Francois Iker, Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Olaf Van der Sluis and Pieter Timmermans

(2010) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 11th International conference, Proceedings.
Add to list
- Journal Article
- A1
Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Jonathan Govaerts (UGent) , Erwin Bosman (UGent) , Wim Christiaens (UGent) and Jan Vanfleteren (UGent)

(2010) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 33(1). p.72-78
Add to list
- PhD Thesis
Integratie van actieve en passieve componenten in polyimideinterconnectiesubstraten.

Wim Christiaens (UGent)

(2009)
Add to list
- Journal Article
- A1
Fabrication processes for embedding thin chips in flat flexible substrates

Jonathan Govaerts (UGent) , Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)

(2009) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 32(1). p.77-83
Add to list
- Journal Article
- A2
Embedded chips redefine miniaturization

Els Parton, Wim Christiaens (UGent) and Jan Vanfleteren (UGent)

(2009) PRINTED CIRCUIT DESIGN & FAB. 26(7). p.37-39
Add to list
- Conference Paper
- P1
- open access
3D Integration of ultra-thin functional devices inside standard multilayer flex laminates

Wim Christiaens (UGent) , Tom Torfs, Wim Huwel, Chris Van Hoof and Jan Vanfleteren (UGent)

(2009) 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2. p.671-675
Add to list
- Conference Paper
- C3
3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems

Wim Christiaens (UGent) , Tom Torfs, Wim Huwel, Chris Van Hoof and Jan Vanfleteren (UGent)

(2009) International Semiconductor Technology Conference and China Semiconductor Technology International Conference, Abstracts.
Add to list
- Conference Paper
- P1
Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection

Jonathan Govaerts (UGent) , Wim Christiaens (UGent) and Jan Vanfleteren (UGent)

(2009) 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III. p.202-205
Add to list
- Conference Paper
- C3
Flexible wireless biopotential system with embedded ultra-thin chip

Tom Torfs, Wim Christiaens (UGent) , Jan Vanfleteren (UGent) , Wim Huwel, Wim Perdu, RF Yazicioglu, Steven Brebels and Chris Van Hoof

(2009) Smart Systems Integration Conference, 3rd, Abstracts.
Add to list
- Journal Article
- A1
Improved passive-matrix multiplexability with a modular display and UTCP technology

Pieter Bauwens (UGent) , Ann Monté (UGent) , Wim Christiaens (UGent) , Jan Doutreloigne (UGent) and Jan Vanfleteren (UGent)

(2009) DISPLAYS. 30(2). p.71-76
Add to list
- Journal Article
- A1
Embedding and assembly of ultrathin chips in multilayer flex boards

Wim Christiaens (UGent) , Thomas Loeher, Barbare Pahl, Michael Feil, Bart Vandevelde and Jan Vanfleteren (UGent)

(2008) CIRCUIT WORLD. 34(3). p.3-8
Add to list
- Conference Paper
- C3
Functionality and Reliability Testing of Bendable Ultrathin Chip Packages

Wim Christiaens (UGent) , Tom Torfs, Wim Huwel and Jan Vanfleteren (UGent)

(2008) p.230-230
Add to list
- Conference Paper
- P1
- open access
Multiple chip integration for flat flexible electronics

Jonathan Govaerts (UGent) , Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)

(2008) 2008 IEEE Conference on polymers and adhesives in microelectronics and photonics and 2008 IEEE interdisciplinary conference on portable information devices. p.137-141
Add to list
- Conference Paper
- P1
Active optical links embedded in flexible substrates

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Wim Christiaens (UGent) , Nina Hendrickx (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2008) ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. p.1150-1157
Add to list
- Conference Paper
- P1
Flexible embedded active optical link

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Wim Christiaens (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2008) Proceedings of SPIE, the International Society for Optical Engineering. 6992.
Add to list
- Conference Paper
- C3
Flexible polyimide based ultra-thin chip package (UTCP)

Wim Christiaens (UGent) , Erwin Bosman (UGent) , Wim Huwel, Wim Perdu and Jan Vanfleteren (UGent)

(2007) Flexible and Stretchable Electronics, 1st International workshop, Abstracts.
Add to list
- Conference Paper
- C1
Embedding of chips in flex: a global optimisation from thermal, mechanical and electrical RF perspective

B VANDEVELDE, L CHEN, S BREBELS, Wim Christiaens (UGent) and Jan Vanfleteren (UGent)

(2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.25-30
Add to list
- Conference Paper
- C1
Integration of thin flexible RF structures into flexible PCB

Wim Christiaens (UGent) , H BURKARD, J LINK and Jan Vanfleteren (UGent)

(2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.621-626
Add to list
- Conference Paper
- C1
Embedding of active components in multilayer flex boards

Wim Christiaens (UGent) , T LOEHER, M FEIL, B VANDEVELDE and Jan Vanfleteren (UGent)

(2007) Proceedings of IMAPS MicroTech 2007.
Add to list
- Conference Paper
- C1
Polyimide based embedding technology for RF structures and active components

Wim Christiaens (UGent) , B VANDEVELDE, S BREBELS and Jan Vanfleteren (UGent)

(2007) Proceedings of the 12 annual SMTA Pan Pacific Microelectronics Symposium. p.22-29
Add to list
- Conference Paper
- P1
- open access
Embedding of optical interconnections in flexible electronics

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2007) 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS. p.1281-1287
Add to list
- Conference Paper
- C1
- open access
Multimode optical interconnections embedded in flexible electronics

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2007) Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference. p.155-160
Add to list
- Journal Article
- A2
New packaging concept for ultra-thin chips

Els Parton and Wim Christiaens (UGent)

(2006) ADVANCED PACKAGING. 15(10). p.20-20
Add to list
- Conference Paper
- C1
UTCP: 60 µm thick bendable package

Wim Christiaens (UGent) , Bart Vandevelde, Erwin Bosman (UGent) and Jan Vanfleteren (UGent)

(2006) International Wafer-Level Packaging Conference, 3rd, Proceedings. p.114-119
Add to list
- Conference Paper
- C3
(Flat) Ultra-thin chip package

Wim Christiaens (UGent) , Bart Vandevelde and Jan Vanfleteren (UGent)

(2006) Meeting of the Symposium on Polymers for Microelectronics, 12th, Abstracts.
Add to list
- Conference Paper
- P1
Optical connections on flexible substrates

Erwin Bosman (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Geert Van Steenberge (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2006) Proceedings of SPIE, the International Society for Optical Engineering.
Add to list
- Journal Article
- A4
Ultra-thin chip package using embedding in spin-on polyimides

Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)

(2006) GOOD-DIE NEWSLETTER. p.41-44
Add to list
- Conference Paper
- C1
A flexible polyimide based circuit for rapid heating of small objects

Bjorn Vandecasteele (UGent) , Kristof Dhaenens (UGent) , Wim Christiaens (UGent) , Lieven Degrendele (UGent) , M STEEL, A VAN LIERE and Jan Vanfleteren (UGent)

(2006) Proceedings of IMAPS Nordic. p.70-74
Add to list
- Conference Paper
- C1
Ultra-thin chip package using embedding in spin-on polyimides

Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)

(2006) European Microelectronics and Packaging Symposium, 4th, Proceedings. p.125-128
Add to list
- Conference Paper
- C1
Embedding of chips in flex and rigid substrates: impact on thermal and mechanical performance

B VANDEVELDE, C CHEN, J SOMMER, Wim Christiaens (UGent) , B VANDECASTEELE, J VANFLETEREN, R REHTINIEMI and A ARSLAN

(2006) Proceedings of the 4th European Microelectronics and Packaging Symposium (EMPS). p.147-152
Add to list
- Conference Paper
- C1
Ultra-thin chip package (UTCP) for flexible electronics applications

Wim Christiaens (UGent) , Bart Vandevelde and Jan Vanfleteren (UGent)

(2006) IMAPS Nordic, Proceedings. p.7-11
Add to list
- Conference Paper
- C1
- open access
Optical interconnections embedded in flexible substrates

Erwin Bosman (UGent) , Wim Christiaens (UGent) , Peter Geerinck (UGent) , Geert Van Steenberge (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2006) Proceedings of the IEEE/LEOS Benelux Chapter Symposium. p.229-232
Add to list
- Conference Paper
- C1
- open access
Optical interconnections embedded in flexible substrates

Erwin Bosman (UGent) , Wim Christiaens (UGent) , Peter Geerinck (UGent) , Geert Van Steenberge (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2006) Proceedings of the 7th UGent PhD symposium.
Add to list
- Journal Article
- A2
Embedding active components as a 3D packaging solution

Maarten Cauwe (UGent) , Wim Christiaens (UGent) , Jan Vanfleteren (UGent) and Johan De Baets (UGent)

(2006) Advancing Microelectronics. 1. p.15-19
Add to list
- Conference Paper
- C1
Flexible embedded components for polyimide substrate

Wim Christiaens (UGent)

(2005) UGent-FirW Doctoraatssymposium, 6e.
Add to list
- Conference Paper
- C3
Embedded ultra-thin chips in flex

Wim Christiaens (UGent) , Michael Feil, Thomas Loeher and Jan Vanfleteren (UGent)

(2005) Flexible Electronic Systems Forum, Abstracts.

3D-stacking of UTCPs as a module miniaturization technology

Design and implementation of flexible and stretchable systems

A Reliable and comfortable package for wearable medical devices

System-in-foil technology

Module miniaturization by ultra thin package stacking

UTCP: a novel polyimide-based ultra-thin chip packaging technology

Thermo-mechanical analysis of flexible and stretchable systems

Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Integratie van actieve en passieve componenten in polyimideinterconnectiesubstraten.

Fabrication processes for embedding thin chips in flat flexible substrates

Embedded chips redefine miniaturization

3D Integration of ultra-thin functional devices inside standard multilayer flex laminates

3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems

Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection

Flexible wireless biopotential system with embedded ultra-thin chip

Improved passive-matrix multiplexability with a modular display and UTCP technology

Embedding and assembly of ultrathin chips in multilayer flex boards

Functionality and Reliability Testing of Bendable Ultrathin Chip Packages

Multiple chip integration for flat flexible electronics

Active optical links embedded in flexible substrates

Flexible embedded active optical link

Flexible polyimide based ultra-thin chip package (UTCP)

Embedding of chips in flex: a global optimisation from thermal, mechanical and electrical RF perspective

Integration of thin flexible RF structures into flexible PCB

Embedding of active components in multilayer flex boards

Polyimide based embedding technology for RF structures and active components

Embedding of optical interconnections in flexible electronics

Multimode optical interconnections embedded in flexible electronics

New packaging concept for ultra-thin chips

UTCP: 60 µm thick bendable package

(Flat) Ultra-thin chip package

Optical connections on flexible substrates

Ultra-thin chip package using embedding in spin-on polyimides

A flexible polyimide based circuit for rapid heating of small objects

Ultra-thin chip package using embedding in spin-on polyimides

Embedding of chips in flex and rigid substrates: impact on thermal and mechanical performance

Ultra-thin chip package (UTCP) for flexible electronics applications

Optical interconnections embedded in flexible substrates

Optical interconnections embedded in flexible substrates

Embedding active components as a 3D packaging solution

Flexible embedded components for polyimide substrate

Embedded ultra-thin chips in flex