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3D-stacking of UTCPs as a module miniaturization technology
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Design and implementation of flexible and stretchable systems
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A Reliable and comfortable package for wearable medical devices
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System-in-foil technology
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Module miniaturization by ultra thin package stacking
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UTCP: a novel polyimide-based ultra-thin chip packaging technology
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- Conference Paper
- C1
- open access
Thermo-mechanical analysis of flexible and stretchable systems
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Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
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Integratie van actieve en passieve componenten in polyimideinterconnectiesubstraten.
(2009) -
Fabrication processes for embedding thin chips in flat flexible substrates
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Embedded chips redefine miniaturization
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- Conference Paper
- P1
- open access
3D Integration of ultra-thin functional devices inside standard multilayer flex laminates
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3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems
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Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection
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Flexible wireless biopotential system with embedded ultra-thin chip
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Improved passive-matrix multiplexability with a modular display and UTCP technology
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Embedding and assembly of ultrathin chips in multilayer flex boards
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Functionality and Reliability Testing of Bendable Ultrathin Chip Packages
(2008) p.230-230 -
- Conference Paper
- P1
- open access
Multiple chip integration for flat flexible electronics
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Active optical links embedded in flexible substrates
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Flexible embedded active optical link
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Flexible polyimide based ultra-thin chip package (UTCP)
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Embedding of chips in flex: a global optimisation from thermal, mechanical and electrical RF perspective
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Integration of thin flexible RF structures into flexible PCB
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Embedding of active components in multilayer flex boards
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Polyimide based embedding technology for RF structures and active components
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- Conference Paper
- P1
- open access
Embedding of optical interconnections in flexible electronics
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- Conference Paper
- C1
- open access
Multimode optical interconnections embedded in flexible electronics
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New packaging concept for ultra-thin chips
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UTCP: 60 µm thick bendable package
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(Flat) Ultra-thin chip package
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Optical connections on flexible substrates
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Ultra-thin chip package using embedding in spin-on polyimides
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A flexible polyimide based circuit for rapid heating of small objects
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Ultra-thin chip package using embedding in spin-on polyimides
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Embedding of chips in flex and rigid substrates: impact on thermal and mechanical performance
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Ultra-thin chip package (UTCP) for flexible electronics applications
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- Conference Paper
- C1
- open access
Optical interconnections embedded in flexible substrates
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- Conference Paper
- C1
- open access
Optical interconnections embedded in flexible substrates
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Embedding active components as a 3D packaging solution
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Flexible embedded components for polyimide substrate
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Embedded ultra-thin chips in flex