Academic Bibliography

Search 200 years of publications by Ghent University researchers.

Jonathan Govaerts

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Developing an advanced module for back-contact solar cells

Jonathan Govaerts (UGent) , J Robbelein, M Gonzalez, I Gordon, K Baert, I De Wolf, Frederick Bossuyt (UGent) , Steven Van Put (UGent) and Jan Vanfleteren (UGent)

(2011) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 1(9). p.1319-1327
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Performance of a new type of module based on back-contact solar cells

Jonathan Govaerts (UGent) , Jo Robbelein, Chun Gong, Bartek J Pawlak, Mario Gonzalez, Ingrid De Wolf, Frederick Bossuyt (UGent) , Steven Van Put (UGent) , Ivan Gordon, Kris Baert, et al.

(2010) Proceedings of SPIE, the International Society for Optical Engineering. In Proceedings of SPIE-The International Society for Optical Engineering 7773.
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Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Jonathan Govaerts (UGent) , Erwin Bosman (UGent) , Wim Christiaens (UGent) and Jan Vanfleteren (UGent)

(2010) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 33(1). p.72-78
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- PhD Thesis
Technology Development and Characterization forInterconnecting Driver Electronic Circuitry to Flat-PanelDisplays.

Jonathan Govaerts (UGent)

(2009)
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Fabrication processes for embedding thin chips in flat flexible substrates

Jonathan Govaerts (UGent) , Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)

(2009) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 32(1). p.77-83
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- Conference Paper
- P1
Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection

Jonathan Govaerts (UGent) , Wim Christiaens (UGent) and Jan Vanfleteren (UGent)

(2009) 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III. p.202-205
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- Conference Paper
- P1
Assembly of Ultra-Thin Chip Packages (UTCPs) for enhanced flexibility of flexible displays

Jonathan Govaerts (UGent) and Jan Vanfleteren (UGent)

(2008) ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS. p.309-313
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- Conference Paper
- P1
- open access
Multiple chip integration for flat flexible electronics

Jonathan Govaerts (UGent) , Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)

(2008) 2008 IEEE Conference on polymers and adhesives in microelectronics and photonics and 2008 IEEE interdisciplinary conference on portable information devices. p.137-141
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- Journal Article
- A1
Interconnecting drivers to flexible displays

Jonathan Govaerts (UGent) , Bjorn Vandecasteele (UGent) and Jan Vanfleteren (UGent)

(2008) JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY. 16(7). p.765-775
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- Conference Paper
- C1
Embedding of thinned chips in plastic substrates

Bjorn Vandecasteele (UGent) , Jonathan Govaerts (UGent) and Jan Vanfleteren (UGent)

(2007) Proceedings of the 12 annual SMTA Pan Pacific Microelectronics Symposium. p.30-35

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