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High speed transceivers beyond 1.6Tb/s for data center networks
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Wafer‐scale integration of single layer graphene electro‐absorption modulators in a 300 mm CMOS pilot line
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- Conference Paper
- C1
- open access
Design of a broadband adiabatic coupler for interfacing PICs to optical redistribution layers
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- Journal Article
- A1
- open access
Unique design approach to realize an O-band laser monolithically integrated on 300 mm Si substrate by nano-ridge engineering
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Low dark current and high responsivity 1020nm InGaAs/GaAs nano-ridge waveguide photodetector monolithically integrated on a 300-mm Si wafer
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- Journal Article
- A1
- open access
Silicon circuits for chip-to-chip communications in multi-socket server board interconnects
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56 Gb/s NRZ O-band hybrid BiCMOS-Silicon photonics receiver using Ge/si avalanche photodiode
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- Journal Article
- A1
- open access
50 GBd PAM4 transmitter with a 55nm SiGe BiCMOS driver and silicon photonic segmented MZM
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- Journal Article
- A1
- open access
400 Gb/s silicon photonic transmitter and routing WDM technologies for glueless 8-socket chip-to-chip interconnects
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- Conference Paper
- P1
- open access
High-speed electronics for silicon photonics transceivers
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- Journal Article
- A1
- open access
Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics
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- Journal Article
- A1
- open access
O-Band silicon photonic transmitters for datacom and computercom interconnects
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- Conference Paper
- P1
- open access
III-V-on-silicon photonic transceivers
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Wafer-level packaging of photonics and electronics for terabit-scale optical interconnects
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DSP-free 52km-long dispersion uncompensated optical link employing a 40 Gb/s O-band silicon microring modulator assembled with a 1V-CMOS driver