Peter Geerinck

Conference Paper
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Wafer-scale integration of lithium niobate on a silicon photonics 200-mm platform

Margot Niels (UGent) , Ewoud Vissers (UGent) , Tom Vanackere (UGent) , Arno Moerman (UGent) , Xiujun Zheng (UGent) , Xin Guo (UGent) , Peter Geerinck (UGent) , Emadreza Soltanian (UGent) , Jing Zhang (UGent) , Sofie Janssen, et al.

(2025) 2025 IEEE PHOTONICS CONFERENCE, IPC. In IEEE Photonics Conference p.1-2

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Demonstration of lithium niobate integration on a 200-mm silicon photonics wafer using transfer printing

Margot Niels (UGent) , Ewoud Vissers (UGent) , Tom Vanackere (UGent) , Arno Moerman (UGent) , Xin Guo (UGent) , Peter Geerinck (UGent) , Emadreza Soltanian (UGent) , Jing Zhang (UGent) , Sofie Janssen, Peter Verheyen, et al.

(2025) OPTICS LETTERS. 50(15). p.4678-4681

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Fully embedded optical and electrical interconnections in flexible foils

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2009) 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2. p.275-279

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Embedding of optical interconnections in flexible electronics

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2007) 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS. p.1281-1287

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Conference Paper
C1
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Multimode optical interconnections embedded in flexible electronics

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2007) Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference. p.155-160

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Laser ablation: a versatile micro-machining technology (poster)

Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Erwin Bosman (UGent) , Steven Van Put (UGent) , Peter Geerinck (UGent) and Peter Van Daele (UGent)

(2007) NEMO Scientific General Networking Meeting.

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Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board

Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Peter Geerinck (UGent) , Erwin Bosman (UGent) , Steven Van Put (UGent) , Jürgen Van Erps, Hugo Thienpont (UGent) and Peter Van Daele (UGent)

(2006) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 6126.

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Optical connections on flexible substrates

Erwin Bosman (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Geert Van Steenberge (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2006) Proceedings of SPIE, the International Society for Optical Engineering.

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Development of a technology for fabricating low-cost parallel optical interconnects

Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Peter Geerinck (UGent) , Erwin Bosman (UGent) , Steven Van Put (UGent) and Peter Van Daele (UGent)

(2006) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 6185.

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Laser ablated coupling structures for stacked optical interconnections on printed circuit boards

Nina Hendrickx (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Jürgen Van Erps, Hugo Thienpont (UGent) and Peter Van Daele (UGent)

(2006) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 6185.

Academic Bibliography

Peter Geerinck

Wafer-scale integration of lithium niobate on a silicon photonics 200-mm platform

Demonstration of lithium niobate integration on a 200-mm silicon photonics wafer using transfer printing

Fully embedded optical and electrical interconnections in flexible foils

Embedding of optical interconnections in flexible electronics

Multimode optical interconnections embedded in flexible electronics

Laser ablation: a versatile micro-machining technology (poster)

Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board

Optical connections on flexible substrates

Development of a technology for fabricating low-cost parallel optical interconnects

Laser ablated coupling structures for stacked optical interconnections on printed circuit boards

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