Peter Geerinck

Mark

conference
P1
open access

Fully embedded optical and electrical interconnections in flexible foils

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2009) 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2. p.275-279

Mark

journalArticle
P1
open access

Embedding of optical interconnections in flexible electronics

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2007) 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS. p.1281-1287

Mark

conference
C1
open access

Multimode optical interconnections embedded in flexible electronics

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2007) Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference. p.155-160

Mark

conference
C1
open access

Laser ablation: a versatile micro-machining technology (poster)

Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Erwin Bosman (UGent) , Steven Van Put (UGent) , Peter Geerinck (UGent) and Peter Van Daele (UGent)

(2007) NEMO Scientific General Networking Meeting.

Mark

Optical connections on flexible substrates

Erwin Bosman (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Geert Van Steenberge (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2006) Proceedings of SPIE, the International Society for Optical Engineering.

Mark

Development of a technology for fabricating low-cost parallel optical interconnects

Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Peter Geerinck (UGent) , Erwin Bosman (UGent) , Steven Van Put (UGent) and Peter Van Daele (UGent)

(2006) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 6185.

Mark

Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board

Geert Van Steenberge (UGent) , Nina Hendrickx (UGent) , Peter Geerinck (UGent) , Erwin Bosman (UGent) , Steven Van Put (UGent) , Jürgen Van Erps, Hugo Thienpont (UGent) and Peter Van Daele (UGent)

(2006) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 6126.

Mark

Laser ablated coupling structures for stacked optical interconnections on printed circuit boards

Nina Hendrickx (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Jürgen Van Erps, Hugo Thienpont (UGent) and Peter Van Daele (UGent)

(2006) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 6185.

Mark

conference
C3
open access

Model for the properties and behavior of electronic paper

Tom Bert, Vincent De Gezelle (UGent) , Geert Van Steenberge (UGent) , Steven Van Put (UGent) , Peter Geerinck (UGent) and Herbert De Smet (UGent)

(2006) SID-MEC Spring meeting, Presentations.

Mark

conference
C1
open access

Optical interconnections embedded in flexible substrates

Erwin Bosman (UGent) , Wim Christiaens (UGent) , Peter Geerinck (UGent) , Geert Van Steenberge (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2006) Proceedings of the IEEE/LEOS Benelux Chapter Symposium. p.229-232

Academic Bibliography

Peter Geerinck

Fully embedded optical and electrical interconnections in flexible foils

Embedding of optical interconnections in flexible electronics

Multimode optical interconnections embedded in flexible electronics

Laser ablation: a versatile micro-machining technology (poster)

Optical connections on flexible substrates

Development of a technology for fabricating low-cost parallel optical interconnects

Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board

Laser ablated coupling structures for stacked optical interconnections on printed circuit boards

Model for the properties and behavior of electronic paper

Optical interconnections embedded in flexible substrates

Contents

Support

Contact