Academic Bibliography

Search 200 years of publications by Ghent University researchers.

Sam Siau

Show Sort by

Add to list
- Journal Article
- A1
Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) , Ives Swennen (UGent) and Etienne Schacht (UGent)

(2004) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 151(8).
Add to list
- Journal Article
- A1
Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) , Ives Swennen (UGent) and Etienne Schacht (UGent)

(2004) APPLIED SURFACE SCIENCE. 237(1-4). p.456-461
Add to list
- Journal Article
- A1
Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - II. Oxidative treatment of the surface

Sam Siau, Alfons Vervaet (UGent) , S NALINES, Etienne Schacht (UGent) and André Van Calster (UGent)

(2004) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 151(12).
Add to list
- Journal Article
- A1
Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - I. Sweller influence

Sam Siau, Alfons Vervaet (UGent) , S NALINES, Etienne Schacht (UGent) and André Van Calster (UGent)

(2004) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 151(12).
Add to list
Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) and Etienne Schacht (UGent)

(2004) Electrochemical Society, 205th Meeting, Abstracts.
Add to list
- Journal Article
- A1
Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) and André Van Calster (UGent)

(2004) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 151(2).
Add to list
- Conference Paper
- P1
Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers : overplating reliability considerations for the solder mask

Sam Siau, Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2003) 26TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, CONFERENCE PROCEEDINGS. p.158-162
Add to list
- Conference Paper
- C1
Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as build-up layer

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) , Ives Swennen (UGent) and Etienne Schacht (UGent)

(2003) Abstracts of the 7th International Conference on Atomically COntrolled Surfaces, Interfaces and Nanostructures. p.496-502
Add to list
- Conference Paper
- C1
- open access
Research of novel metal-polymer binding strategies in sequential buildup substrate technology

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) and Etienne Schacht (UGent)

(2003) Industrie-Ready Innovative Research 1st Flanders Engineering PhD Symposium.
Add to list
- Conference Paper
- C3
- open access
Research of novel metal-polymer binding strategies in sequential build-up technology.

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) and Etienne Schacht (UGent)

(2003) Fourth UGent-FTW PhD Symposium.

← Previous

1
2
3

Next →