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- Conference Paper
- C1
- open access
XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments
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Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics
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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics
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The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper
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Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper
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Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
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Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
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Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes
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Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments
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Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer
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Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - II. Oxidative treatment of the surface
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Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - I. Sweller influence
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Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper
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Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections
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Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers : overplating reliability considerations for the solder mask
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Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as build-up layer
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- Conference Paper
- C1
- open access
Research of novel metal-polymer binding strategies in sequential buildup substrate technology
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- Conference Paper
- C3
- open access
Research of novel metal-polymer binding strategies in sequential build-up technology.
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Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for usage as build-up layer