Academic Bibliography

Search 200 years of publications by Ghent University researchers.

Bjorn Vandecasteele

Faculty of Engineering and Architecture > Department of Electronics and information systems

Work address: Technologiepark Zwijnaarde 126
9052 Zwijnaarde
Email: Bjorn.Vandecasteele@UGent.be

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Development of an active high-density transverse intrafascicular micro-electrode probe

Rik Verplancke (UGent) , Maarten Cauwe (UGent) , David Schaubroeck (UGent) , Dieter Cuypers (UGent) , Bjorn Vandecasteele (UGent) , Lothar Mader (UGent) , Celine Vanhaverbeke (UGent) , Marco Ballini, John O’Callaghan, Erkuden Goikoetxea, et al.

(2020) JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 30(1). p.1-13
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- Conference Paper
- C3
FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers

Maaike Op de Beeck (UGent) , Rik Verplancke (UGent) , David Schaubroeck (UGent) , Changzheng Li, Dieter Cuypers (UGent) , Maarten Cauwe (UGent) , Bjorn Vandecasteele (UGent) , Lothar Mader (UGent) , Celine Vanhaverbeke (UGent) , John O’Callaghan, et al.

(2019) Advanced Packaging for Medical Microelectronics, 2019 Advanced Technology Workshop, Abstracts.
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3D multifunctional composites based on large-area stretchable circuit with thermoforming technology

Yang Yang (UGent) , Thomas Vervust (UGent) , Sheila Dunphy (UGent) , Steven Van Put (UGent) , Bjorn Vandecasteele (UGent) , Kristof Dhaenens (UGent) , Lieven Degrendele (UGent) , Lothar Mader (UGent) , Linde De Vriese, Tom Martens, et al.

(2018) ADVANCED ELECTRONIC MATERIALS. 4(8).
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Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves

Maaike Op de Beeck (UGent) , Rik Verplancke (UGent) , David Schaubroeck (UGent) , Dieter Cuypers (UGent) , Maarten Cauwe (UGent) , Bjorn Vandecasteele (UGent) , John O'Callaghan, Dries Braeken, Alexandru Andrei, Andrea Firrincieli, et al.

(2017) Biomedical Circuits and Systems Conference.
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- Conference Paper
- C3
- open access
Thermoplastically Shaped Wearable Medical Devices

Bart Plovie (UGent) , Sheila Dunphy (UGent) , Kristof Dhaenens (UGent) , Steven Van Put (UGent) , Bjorn Vandecasteele (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2017) Proc. 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC).
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Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers

Bart Plovie (UGent) , Yang Yang (UGent) , Joren Guillaume, Sheila Dunphy (UGent) , Kristof Dhaenens (UGent) , Steven Van Put (UGent) , Bjorn Vandecasteele (UGent) , Thomas Vervust (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2017) ADVANCED ENGINEERING MATERIALS. 19(8).
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2.5D smart objects using thermoplastic stretchable interconnects

Bart Plovie (UGent) , Sheila Dunphy (UGent) , Kristof Dhaenens (UGent) , Steven Van Put (UGent) , Bjorn Vandecasteele (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2015) International Symposium on Microelectronics, Proceedings. 2015(1). p.000868-000873
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Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

George Vakanas, O Minho, Biljana Dimcic, Kris Vanstreels and Bjorn Vandecasteele (UGent)

(2015) MICROELECTRONIC ENGINEERING. 140(140). p.72-80
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A KA-Band sige Bicmos power amplifier with 24 DBM output power

Ramses Pierco (UGent) , Guy Torfs (UGent) , Timothy De Keulenaer (UGent) , Bjorn Vandecasteele (UGent) , Jeroen Missinne (UGent) and Johan Bauwelinck (UGent)

(2015) MICROWAVE AND OPTICAL TECHNOLOGY LETTERS. 57(3). p.718-722
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Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers

Jan Vanfleteren (UGent) , Imen Chtioui, Bart Plovie (UGent) , Yang Yang (UGent) , Frederick Bossuyt (UGent) , Thomas Vervust (UGent) , Sheila Dunphy (UGent) and Bjorn Vandecasteele (UGent)

(2014) Procedia Technology. In Procedia Technology 15. p.208-215

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