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Electrical behavior of decoupling capacitors embedded in multilayered PCBs.
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Comparison of test methods for the characterization of shielding of board-to-backplane and board-to-cable connectors.
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Electrical characterisation of capacitors integrated in multi-layer printed circuit boards 3rd Workshop on Signal Propagation on Interconnects, Session 5: Measurement Techniques, 19-21 May 1999, Titisee-Neustadt, Germany,.
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Electrical performance of buried capacitors in multi-layered PCBs.
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Mixed component integration in advanced printed wiring boards
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Shielding of backplane interconnection technology systems (EU SOBITS project)
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Shielding of backplane interconnection technology systems (EU SOBITS project)
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Electrical performance of capacitors integrated in multi-layered printed circuit boards Interconnects in VLSI Design (Kluwer Academic Publishers), ISBN 0-7923-7997-7, October 2000, pp. 133-146.
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Mixed component integration in MCM-L technologyCARTS Europe '99: 13th European Passive Components Symposium, 18-22 October 1999, Lisbon, Portugal, pp. 113-118.