Academic Bibliography

Search 200 years of publications by Ghent University researchers.

Jan De Geest

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A generative modeling framework for statistical link analysis based on sparse data

Simon De Ridder, Paolo Manfredi (UGent) , Jan De Geest, Dirk Deschrijver (UGent) , Daniël De Zutter (UGent) , Tom Dhaene (UGent) and Dries Vande Ginste (UGent)

(2018) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 8(1). p.21-31
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A novel generative stochastic model for high-speed interconnection links

Simon De Ridder, Paolo Manfredi (UGent) , Jan De Geest, Tom Dhaene (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2017) p.1-23
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Constrained EM-based modeling of passive components.

Tom Dhaene (UGent) , Jan De Geest and Daniël De Zutter (UGent)

(2002) 2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3. p.2113-2116
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Modeling complex via hole structures.

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2002) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 25(2). p.206-214
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Recovering lossy multiconductor transmission line parameters from impedance or scattering representations.

Luc Knockaert (UGent) , Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Eric Laermans (UGent) and Jan De Geest

(2002) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 25(2). p.200-205
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EM-based multidimensional parameterized modeling of general passive planar components.

Tom Dhaene (UGent) , Jan De Geest and Daniël De Zutter (UGent)

(2001) 2001 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3. p.1745-1748
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Recovering lossy multiconductor transmission line parameters from impedance or scattering representations.

Luc Knockaert (UGent) , Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Eric Laermans (UGent) and Jan De Geest

(2001) ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING. p.35-38
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- Conference Paper
- P1
Modelling complex via hole structures

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2001) ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING. p.149-152
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- Journal Article
- A1
Modeling differential via holes.

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2001) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 24(3). p.357-363
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- Conference Paper
- C1
Modelling complex via hole structures.

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2001) Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA. p.149-152

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