Luc Vanwassenhove
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Demonstrating optoelectronic interconnect in a FPGA based prototype system using flip chip mounted 2D arrays of optical components and 2D POF-ribbon arrays as optical pathways
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Demonstrating POF based optoelectronic interconnect in a multi-FPGA prototype system
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2D inter-chip optical interconnect.
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Demonstration of 2-D Plastic Optical Fibre based optical interconnect between CMOS IC's.
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Substrate-removed 850-nm RCLEDs and small core (63/125 µm) plastic optical fibers for optical data communication
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Two dimensional optical interconnect between CMOS IC's
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Fabrication of a 2D connector for coupling a 4x8 array of small diameter plastic optical fiber (117/125 mu m) to MCLED or VCSEL arrays
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Fabrication of microgrooves with excimer laser ablation techniques for plastic optical fibre array alignment purposes.
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An optical area I/O enhanced FPGA with 256 optical channels per chip
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Microgroove fabrication with excimer laser ablation techniques for optical fibre array alignment purposes
(2000) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 4088. p.327-332 -
MT (TM)-compatible connectorisation of VCSEL and RCLED arrays to plastic optical fibre ribbon for low cost parallel datalinks.
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Fabrication of a 2D connector for coupling a 4x8 array of small diameter plastic optical fiber (117/125 ?m) to MCLED or VCSEL arrays.
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Fabrication of microgrooves with excimer laser ablation techniques for Plastic Optical Fibre array alignment purposes.
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Two-dimensional optical interconnect between CMOS IC's.
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A system demonstrator using 2-D fibre-based optical interconnect between CMOS IC's.
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2-dimensional fiber-based optical interconnect between CMOS IC's
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High Q InGaAsP ring resonator filters
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Technologies for two-dimensional optical interconnect between CMOS IC's
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Realisation of highly efficient and high-speed Resonant Cavity LED for coupling to Plastic Optical Fibres
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Direct MT™-compatible connectorisation of VCSEL and LED-arrays to plastic optical fiber ribbon for low cost parallel datalinks
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Realization and characterization of 8 x 8 resonant cavity LED arrays mounted onto CMOS drivers for POF-based interchip interconnections.
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Excimer laser ablated U-groove alignment structure for optical fibre arrays.
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Montage en alignatie van rijen opto-elektronische componenten
(1998) -
Flip chip mounted substrate-removed 850nm bottom-emitting 8x8 MCLED arrays with selectively oxidised current windows.
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Microcavity LEDs coupled to POF arrays for parallel optical interconnects.
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Design and fabrication of a two layer thin film interconnection system on glass for use in a parallel free-space optical interconnection demonstrator
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MT-compatible module for coupling LED- to POF-arrays.
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Demonstration of phased-array laser with gain-clamped output amplifier.
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Realisation of multi-wavelength phased array laser by hybrid coupling of active and passive waveguide chips.
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Low-cost fibre-chip coupling for electro-optic EMC-probes
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Low-cost fibre-chip coupling for electro-optic EMC-probes.
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New waveguide-fiber coupling method for fiber arrays based on integrated elliptic couplers
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Micro-cavity LED's and their application in optical interconnect research within the IUAP-24 project (Invited Paper).
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Micro-cavity LED's and their application in optical interconnect research within the IUAP-24 project (invited).
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Monolithic integration of a spot size transformer with an InGaAsP/InP-laser by shadow masked growth.
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Use of advanced packaging techniques for mounting and alignment of optoelectrical components
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Flip-Chip technology for low cost optical interconnections.
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An active electro-optical loop and dipole probe for electromagnetic near-field measurements
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Vertically tapered InGaAsP/InP waveguides and lasers resulting in low-loss fibre-chip coupling.
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A room temperature flip-chip mounting technique for laser diodes on Silicon motherboards.