Dominique Wojciechowski 1 – 6 of 6 publications Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Filter publications Download search results Subscribe to news feed Add to list Conference Paper P1 New adhesives for high density flip-chip interconnections Dominique Wojciechowski, Jan Vanfleteren (UGent) , E REESE and H HAGEDORN (1998) 1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS. p.224-229 Add to list Conference Paper C1 New adhesives for high density flip-chip interconnection Dominique Wojciechowski, Jan Vanfleteren (UGent) , E REESE and H HAGEDORN (1998) Proceedings of the International Symposium on Microelectronics, San Diego, november. p.224-229 Add to list Miscellaneous An Anisotropie Adhesive Flip-Chip Technology for LCD Drivers M Vrana, Johan De Baets (UGent) , André Van Calster (UGent) and Dominique Wojciechowski (1996) Digest of Technical papers, Vol. 27, SID, San Diego, California, mei pp. 929- 932. Add to list Conference Paper C1 Flip-chip technology for chip-on-glass applications (LCD) Dominique Wojciechowski, André Van Calster (UGent) , M VRANA, Johan De Baets (UGent) , M DE CALUWE and P BOSCH (1996) Proceedings of the European Conference on Electronic Packaging Technology, Vol. 173, Deutscher Verband für Schweisstechnik (DVS), Essen, Germany, januari. p.47-50 Add to list Conference Paper C1 Design of an x-Si active matrix for high resolution reflective displays Johan De Baets (UGent) , André Van Calster (UGent) , Herbert De Smet (UGent) , Jean Van Den Steen, Geert Van Doorselaer, Dominique Wojciechowski, Guust Schols and Johan Witters (1995) Proceedings of the 15th International Display Research Conference, Hamamatsu, Japan, oktober. p.477-479 Add to list Conference Paper C1 Technology-CAD applied to the development of DMOS devices Dominique Wojciechowski, André Van Calster (UGent) and J WITTERS (1995) Proceedings of the International Semiconductor Device Research Symposium, Charlottesville, Virginia USA, december. p.785-788
