Dominique Wojciechowski 1 – 6 of 6 publications Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Filter publications Save this search Download search results Subscribe to news feed Add to list Conference Paper P1 New adhesives for high density flip-chip interconnections Dominique Wojciechowski, Jan Vanfleteren (UGent) , E REESE and H HAGEDORN (1998) 1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS. p.224-229 Add to list Conference Paper C1 New adhesives for high density flip-chip interconnection Dominique Wojciechowski, Jan Vanfleteren (UGent) , E REESE and H HAGEDORN (1998) Proceedings of the International Symposium on Microelectronics, San Diego, november. p.224-229 Add to list Miscellaneous An Anisotropie Adhesive Flip-Chip Technology for LCD Drivers M Vrana, Johan De Baets (UGent) , André Van Calster (UGent) and Dominique Wojciechowski (1996) Digest of Technical papers, Vol. 27, SID, San Diego, California, mei pp. 929- 932. Add to list Conference Paper C1 Flip-chip technology for chip-on-glass applications (LCD) Dominique Wojciechowski, André Van Calster (UGent) , M VRANA, Johan De Baets (UGent) , M DE CALUWE and P BOSCH (1996) Proceedings of the European Conference on Electronic Packaging Technology, Vol. 173, Deutscher Verband für Schweisstechnik (DVS), Essen, Germany, januari. p.47-50 Add to list Conference Paper C1 Design of an x-Si active matrix for high resolution reflective displays Johan De Baets (UGent) , André Van Calster (UGent) , Herbert De Smet (UGent) , Jean Van Den Steen, Geert Van Doorselaer, Dominique Wojciechowski, Guust Schols and Johan Witters (1995) Proceedings of the 15th International Display Research Conference, Hamamatsu, Japan, oktober. p.477-479 Add to list Conference Paper C1 Technology-CAD applied to the development of DMOS devices Dominique Wojciechowski, André Van Calster (UGent) and J WITTERS (1995) Proceedings of the International Semiconductor Device Research Symposium, Charlottesville, Virginia USA, december. p.785-788
