ereprof. dr. ir. Jan Vanfleteren
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Reduced temperature flip-chip technologies on flexible display substrates using adhesives
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An O/E measurement probe based on an optics-extended MCM-D motherboard technology
(2002) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 4931. p.936-941 -
High density flip chip with adhesives on ceramics.
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- Conference Paper
- P1
- open access
Laser via generation into flexible substrates
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Reliability of different flex materials in high density flip chip on flex applications
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Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations
(2001) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 4428. p.302-307 -
Low temperatue flip-chip assembly for biomedical applications.
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Assembly of reflective PDLC microdisplays
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Method for measuring the cell gap in liquid-crystal displays.
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Cell gap optimization and alignment effects in reflective PDLC microdisplays.