prof. dr. ir. Jan Vanfleteren

Faculty of Engineering and Architecture > Department of Electronics and information systems

Work address: Technologiepark Zwijnaarde 126
9052 Zwijnaarde
Email: Jan.Vanfleteren@UGent.be
ORCID iD: 0000-0002-9654-7304
Bio (via ORCID): Polymer Microsystems Technologies, Electronics Packaging and Interconnection, wearable and implantable sensors and electronics circuits, microfluidics

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Development of a microfluidic chip powered by EWOD for in vitro manipulation of bovine embryos

Adriana Karcz (UGent) , Ann Van Soom (UGent) , Katrien Smits (UGent) , Sandra Van Vlierberghe (UGent) , Rik Verplancke (UGent) , Osvaldo Américo Bogado Pascottini (UGent) , Etienne Van den Abbeel (UGent) and Jan Vanfleteren (UGent)

(2023) BIOSENSORS-BASEL. 13(4).
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- Conference Paper
Label-free electrochemical immunosensor for cervical cancer screening

Sallam Al-Madhagi (UGent) , Patricia Khashayar (UGent) , Bo Verberckmoes (UGent) , Evelien Peeters (UGent) , Elien De Paepe (UGent) , Heleen Vermandere (UGent) , Mieke Adriaens (UGent) , Jan Vanfleteren (UGent) , Olivier Degomme (UGent) and Elizaveta Padalko (UGent)

(2023)
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- Conference Paper
P16/KI67 LEVELS TO REVOLUTIONIZE CELLULAR DYSPLASIA DETECTION IN CERVICAL CANCER

Patricia Khashayar (UGent) , Sallam Al-Madhagi (UGent) , Bo Verberckmoes (UGent) , Evelien Peeters, Elien De Paepe (UGent) , Heleen Vermandere (UGent) , Marleen Praet, Olivier Degomme (UGent) , Elizaveta Padalko (UGent) , Mieke Adriaens (UGent) , et al.

(2023)
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- Conference Paper
Measuring the Flex Life of Conductive Yarns in Narrow Fabric

Paula Veske (UGent) , Frederick Bossuyt (UGent) , Filip Thielemans (UGent) and Jan Vanfleteren (UGent)

(2023) E-Textiles 2022.
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A novel method for component positioning in thermoformed electronics

Behnam Madadnia (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2023) ADVANCES IN SYSTEM-INTEGRATED INTELLIGENCE, SYSINT 2022. In Lecture notes in networks and systems 546. p.607-615
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Process optimization of injection overmolding structural electronics with regard to film distortion

Martin Hubmann, Behnam Madadnia (UGent) , Jonas Groten, Martin Pletz, Jan Vanfleteren (UGent) , Barbara Stadlober, Frederick Bossuyt (UGent) , Jatinder Kaur and Thomas Lucyshyn

(2022) POLYMERS. 14(23).
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Innovative component positioning method for thermoformed electronics

Behnam Madadnia (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2022) FLEXIBLE AND PRINTED ELECTRONICS. 7(4).
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A study on over-molded copper-based flexible electronic circuits

Mona Bakr (UGent) , Martin Hubmann, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2022) MICROMACHINES. 13(10).
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Using non-stretchable structures for component positioning in thermoformed electronics

Behnam Madadnia (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2022) FLEXIBLE AND PRINTED ELECTRONICS. 7(3).
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Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics

Behnam Madadnia (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2022) INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY. 119(9-10). p.6649-6663

Academic Bibliography

prof. dr. ir. Jan Vanfleteren

Development of a microfluidic chip powered by EWOD for in vitro manipulation of bovine embryos

Label-free electrochemical immunosensor for cervical cancer screening

P16/KI67 LEVELS TO REVOLUTIONIZE CELLULAR DYSPLASIA DETECTION IN CERVICAL CANCER

Measuring the Flex Life of Conductive Yarns in Narrow Fabric

A novel method for component positioning in thermoformed electronics

Process optimization of injection overmolding structural electronics with regard to film distortion

Innovative component positioning method for thermoformed electronics

A study on over-molded copper-based flexible electronic circuits

Using non-stretchable structures for component positioning in thermoformed electronics

Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics

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