ir. Johan De Baets
- ORCID iD
- 0000-0001-5817-8598
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- Journal Article
- A2
- open access
An artificial iris ASIC with high voltage liquid crystal driver, 10-nA light range detector and 40-nA blink detector for LCD flicker removal
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- Conference Paper
- P1
- open access
An artificial iris ASIC with high voltage liquid crystal driver and 10nA light range detector and 40nA blink detector for LCD flicker removal
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FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
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Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves
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- Conference Paper
- C1
- open access
Passive component embedding in printed circuit boards for space applications
(2017) p.1-22 -
Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components
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- Conference Paper
- C1
- open access
Passive component embedding in printed circuit boards for space applications
(2016) -
Stretchable 45 x 80 RGB LED display using meander wiring technology
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- Conference Paper
- P1
- open access
Mechanical analysis of encapsulated metal interconnects under transversal load
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- Conference Paper
- C1
- open access
Reduced 2nd level solder joint life time of low-CTE mold compound packages
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- Conference Paper
- P1
- open access
Flexible and stretchable electronics for wearable healthcare
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- Conference Paper
- C1
- open access
Flexible and stretchable circuit technologies for space applications
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- Conference Paper
- P1
- open access
Embedded passive components for improved power plane decoupling
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In situ monitoring of urine and sweat contamination in bed linen
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- Conference Paper
- C1
- open access
Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
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- Conference Paper
- P1
- open access
Plastic electronics based conformable electronic circuits
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- Conference Paper
- P1
- open access
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
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Surface modification of a photo definable epoxy resin with polyamines and polydopamine to improve adhesion with electroless deposited copper
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Surface modification of a photo-definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
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- Conference Paper
- C1
- open access
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
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Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
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Chemical modification of a photo definable epoxy resin with polyamines to improve adhesion with electroless deposited copper
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System-in-foil technology
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Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components
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Mechanistic aspects of selective laser patterning of multilayered thin-film structures in OLED fabrication
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Surface modification of an epoxy resin with polyamines via cyanuric chloride coupling
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A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources
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Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification
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Chemical modification of a photo definable epoxy resin to improve adhesion with electroless copper
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- Conference Paper
- P1
- open access
Industrial and technical aspects of chip embedding technology
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Systems-in-foil: devices, fabrication processes and reliability issues
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Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
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Cost modelling for embedded component technology
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High-frequency modeling and measurements of tracks running on top of active components embedded in printed circuit boards
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Stretchable conductor technology for elastic electronic systems
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Advanced substrates and packages for wearable electronics and sensors
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Stretchable electronic systems
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High-frequency characterization of embedded active components in printed circuit boards
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Improvement of copper adhesion by chemical modification of epoxy surfaces.
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Embedding active components as a 3D packaging solution
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Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics
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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers
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Technology for Embedding Active Dies
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Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
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Image processing techniques for characterisation of polymer wear debris
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A parallel optical interconnect link with on-chip optical access
(2004) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 5453. p.124-133 -
Redistribution on wafer: an alternative, cost-efficient approach
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Integration of thick film resitors in a multilayer structure
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Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers : overplating reliability considerations for the solder mask
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Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes
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Thick film inductors for RF applications
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Integrated optics in a standard MCM-D motherboard technology demonstrated i O/E measurement probes
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Integration of Thick Film resistors in a multilayer structure
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Optimization of microvia-technology using an excimer laser for application in microelectronics
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Excimer laser microvia-technology in multichip modules
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An O/E measurement probe based on an optics-extended MCM-D motherboard technology
(2002) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 4931. p.936-941 -
Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations
(2001) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 4428. p.302-307 -
Standard SMT process for flip-chip assembly on FR4 substrate
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Photovia technology: Some important aspects for reliability
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Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.
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Low Cost High-Density Multilayer Circuits for MCM-C.
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Low cost high-density multilayer circuits for MCM-C.
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Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies.
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A new approach to flip chip on board technology using SMT compatible processes.
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A new approach to flip chip on board technology using SMT compatible processes.
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Photovia technology: Some important aspects for reliability.
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The fabrication and reliability of a photovia test vehicle for MCM-L applications.
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Technology and circuit aspects of reflective PNLC microdisplays
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A poly-CdSe active matrix for PNLC projection displays
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Flip-chip assembly for chips with gold bumps on high density thick film substrates
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Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly
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An Anisotropie Adhesive Flip-Chip Technology for LCD Drivers
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Flip-chip technology for chip-on-glass applications (LCD)
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A Poly-CdSe Active matrix for PNLC projection Displays
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Modelling poly-CdSe TFTs for AMLCD
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Design of an x-Si active matrix for high resolution reflective displays
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A new cost-effective TAB technology for small and medium volumes
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New model for the characterization and simulation of TFTs in all operating regions
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Modelling poly-CdSe TFTs for AMLCD
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A simplified 3-step fabrication scheme for high mobility AMLCD panels
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Analysis of transient photoconductivity in CdSe:Cu:Cl thin films
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Hysteresis phenomena in active matrix adressed polymer network Liquid Crystal Displays
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A polymer-network liquid-crystal poly-CdSe-TFT active-matrix display
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A lensless contact-type image sensor-based on a CdSe photoconductive array
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Active matrix design for polymer network liquid crystal projection displays
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CdSe thin film transistors for the addressing of liquid crystal displays
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Silicon oxynitride layers for device passivation
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Thin-film cadmium selenide technology in large area active matrix high resolution displays
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CdSe-based thin-film integrated optical sensors
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Failure mechanisms in dielectrics
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Evaluation of a 64x64 CdSe TFT addressed ACTFEL display demonstrator
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CdSe based thin film integrated optical sensors
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A polymer network liquid crystal poly-CdSe TFT active matrix display
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Thin film transistors for flat screen displays
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Complementary CdSe In/Ge Cu TFT circuits for integrated display drivers
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Design of a prototype active matrix CdSe TFT addressed EL display
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A correlation between I/F-noise and short-term drift in poly-CdSe- in thin-film transistors
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2-MHz clocked LCD drivers on glass
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High-voltage polycrystalline CdSe thin-film transistors
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The electrical performance of a complementary CdSe:In/Ge:Cu thin film transistor technology for flat panel displays
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The influence of low copper-doping concentrations on the recrystallisation process in and the electrical-properties of germanium in Ge-Cu thin-film transistors
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On the field effect in polycrystalline CdSe thin-film transistors
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Polycrystalline CdSe films for thin film transistors.
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Polycrystalline CdSe films for Thin Film Transistors.
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A new technology for fast switching-circuits on glass
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Polycrystalline CdSe Films for Thin Film Transistors.
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Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.
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Active matrix with integrated drivers on soda-lime glass using poly-CdSe and poly-Ge. Journal of the SID, Vol. 1/4, pp. 423-428, 1993.
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Geometric Design of Lensless Photoconductive Cotact-type Image Sensors. Journal of the SID, Vol. 1, Nr. 2, pp. 233-241, 1993.
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Generalised TFT-Model for 4-Quadrant Simulations. Proc. of the 3rd Int. CdSe Workshop, Strasbourg, 1993.
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On the Physical Properties of a New HVTFT Design. Proc. of the 3rd Int. CdSe Workshop, Strasbourg, 1993.
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Thin Film Technologies for High Density Active Matrix Adressed Displays. Proc. of the 9th European Hybrid Microelectronics Conf., pp. 84-90, Nice, 1993.
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CdSe Thin Film Transistors for the Adressing of Liquid Crystal Displays. Voorgesteld op de 'Summer European Liquid Crystal Conference', Vilnius, Lithouwen, 1991.