Peter Degraeuwe
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Experimentele hoogfrekwent-karakterisatie van elektrische interconnecties met planaire contacten
(1993) -
Characterization of a new type of MCM-connector. Workshop on VLSI Packaging Techniques and Manufacturing Technologies, Stockholm, Zweden, Jun. 1992.
(1992) -
Measurement set-up for high-frequency characterization of planar contact de vices. 39th Automatic RF Techniques Group (ARFTG), Albuquerque, USA, Jun. 1992.
(1992) -
Improved time-domain characterization of high-speed interconnection structures'. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 142-144.
(1992) -
Accurate characterization of a high-speed and high-density multichip module connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 131-133.
(1992) -
Measurement set-up for high-frequency and high-speed interconnections. Proc. of third European Joint Conference, pp. 2-3 1/2-3- 7, Brussels, Bel gium, 17-19 Jun. 1992.