Koenraad Allaert

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- Conference Paper
- P1
Photovia technology: Some important aspects for reliability

Suixin Zhang, Johan De Baets (UGent) , André Van Calster (UGent) , Dorina Corlatan, Pascal De Langhe and Koenraad Allaert

(1999) 1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS. p.240-245
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- Conference Paper
- C1
Photovia technology: Some important aspects for reliability.

Suixin Zhang, Johan De Baets (UGent) , André Van Calster (UGent) , Dorina Corlatan, P DE LANGHE and Koenraad Allaert

(1999) Proceedings of Imaps 99, Chicago, oktober 1999. p.240-245
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- Conference Paper
- C1
The realisation of photo-via technology using multiposit as a photo imageable dielectric

Suixin Zhang, Maria Vereeken, J DEBAETS, André Van Calster (UGent) , J PEETERS and Koenraad Allaert

(1998) Proceedings of the 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics ( EuPac '98), DVS.juni. p.62-65
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- Miscellaneous
Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly

S Zang, M Vereecken, Johan De Baets (UGent) , André Van Calster (UGent) , Alfons Vervaet (UGent) , J Peeters and Koenraad Allaert

(1997) Printed Circuit Board Technology, Fraunhofer-Institute /ZM, Hotel Intercontinental, Berlin, januari 1997.
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- Conference Paper
- C1
Development of an adhesive TAB joining technology

Jan Vanfleteren (UGent) , André Van Calster (UGent) , Kris Sabbe, M DE CALUWE, A DRAVET, P KERTESZ, S SECHER, K DECKELMANN, J WIESE, E CORTES, et al.

(1996) Proceeding of the European Conference on Electronic Packaging Technology, Vol. 173, Deutscher Verband für Schweisstechnik (DVS), Essen, Germany, januari. p.24-26
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- Journal Article
- A2
Interconnection Technology for Advanced High density Thick Films

M VRANA, André Van Calster (UGent) , R VANDEN BERGHE and Koenraad Allaert

(1996) Microelectronics International. 13(3). p.5-8
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- Conference Paper
- C1
Radiated emission of PCB tracks.

Pascal De Langhe, Femke Olyslager (UGent) , Ann Franchois (UGent) , Daniël De Zutter (UGent) and Koenraad Allaert

(1996) 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics, 31 January - 2 February Essen, Germany. p.140-142
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- Conference Paper
- C1
Characterization of integrated resistors for broadband telecom printed circuit boards

J PEETERS, Ann Ackaert (UGent) , L VANDAM, Koenraad Allaert, M BOTTE, L VAN DEN TORREN, Luc Martens (UGent) and Daniël De Zutter (UGent)

(1996) Proc. of the Technical Conference IPC Prnted Circuits Expo 1996, 3-7 March San Jose, California, pp. S6-l-l->S6-l-10.
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- Conference Paper
- C1
The use of integrated resistors and buried capacitance in high performance telecom printed circuit boards

J PEETERS, E ROOSE, L VANDAM, Ann Ackaert (UGent) , Koenraad Allaert, L VAN DEN TORREN and Luc Martens (UGent)

(1996) 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics, 31 January - 2 February Essen, Germany. p.11-14
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- Conference Paper
- C1
A new cost-effective TAB technology for small and medium volumes

A DRA VET, S SECHEZ, André Van Calster (UGent) , Johan De Baets (UGent) , Jan Vanfleteren (UGent) , Koenraad Allaert, P VETTER, M FORREST, G SCHOLS, K DECKELMANN, et al.

(1995) Proceedings of the 10th European Microelectronics Conference, Copenhagen, Denmark, mei. p.547-558
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- Conference Paper
- C1
Interconnection technology for advanced high density thick films

M VRANA, André Van Calster (UGent) , R VANDEN BERGHE and Koenraad Allaert

(1995) Proceedings of the 10th European Microelectronics Conference mei. p.190-198
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- Miscellaneous
Photoimageable Thick Films for Multichip Modules

M VRANA, André Van Calster (UGent) , D VANICKY, W DELABARE, R VANDEN BERGHE, S DE MOLDER and Koenraad Allaert

(1995) Microelectronics International, No. 36, januari. p.16-18
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- Journal Article
- A4
Samenwerking industrie-universiteit helpt de EMC-materie te ontmaskeren

Koenraad Allaert, M Cumps, Pascal De Langhe, R De Smedt, Ann Franchois (UGent) , Daniël De Zutter (UGent) , Luc Martens (UGent) and Femke Olyslager (UGent)

(1995) HET INGENIEURSBLAD. p.21-34
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- Conference Paper
- P1
Failure mechanisms in dielectrics

R Vanden Berghe, S Demolder, M Saille, Koenraad Allaert, Anita De Bruycker, Johan De Baets (UGent) , André Van Calster (UGent) , Jan Vanfleteren (UGent) , Igor De Rycke, Herbert De Smet (UGent) , et al.

(1991) 8TH EUROPEAN HYBRID MICROELECTRONICS CONFERENCE, PROCEEDINGS. p.157-164
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- PhD Thesis
Karakterisatie van PECVD siliciumnitride en toepassing als totale passivatielaag voor chips

Koenraad Allaert

(1987)
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- Conference Paper
- C1
Evaluation of PCVD Silicon Nitride as a Total Passivation Layer for Chips.

Koenraad Allaert, André Van Calster (UGent) and Alfons Vervaet (UGent)

(1986) Proceedings of the 5th VLSI Packaging Workshop.
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- Conference Paper
- C1
P.C.V.D. SIN Conformal Coatings for the Improvement of the Reliability of Wire Bonded Chips.

Koenraad Allaert, André Van Calster (UGent) and Alfons Vervaet (UGent)

(1986) International Symposium on the Physical and Failure Analysis of Integrated Circuits.
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- Journal Article
- A1
A comparison between silicon-nitride films made by PCVD of N2-SiH4/Ar and N2-SiH4/He

Koenraad Allaert, André Van Calster (UGent) , H Loos and A Lequesne

(1985) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 132(7). p.1763-1766
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- Conference Paper
- C1
Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.

André Van Calster (UGent) , Johan De Baets (UGent) , Jan Vanfleteren (UGent) , A DRAVET, Koenraad Allaert, E CORTES, K DECKELMAN and G SCHOLS
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- Conference Paper
- C1
Plhoto-imageable thick films for multichipmodules. International Conference on electronic Technologies, pp. 41-45, Windsor, 1994.

M VRANA, André Van Calster (UGent) , D VANICKY, W DELBARE, R VANDEN BERGHE, S DEMOLDER and Koenraad Allaert
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- Miscellaneous
Fabrication of High Density Multi-Chip Modules with Standard IC Production Equipment. Hybrid Circuits, Nr. 30, pp. 27-30, 1993.

B DE MEULEMEESTER, André Van Calster (UGent) , Anita De Bruycker and Koenraad Allaert

Academic Bibliography

Koenraad Allaert

Photovia technology: Some important aspects for reliability

Photovia technology: Some important aspects for reliability.

The realisation of photo-via technology using multiposit as a photo imageable dielectric

Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly

Development of an adhesive TAB joining technology

Interconnection Technology for Advanced High density Thick Films

Radiated emission of PCB tracks.

Characterization of integrated resistors for broadband telecom printed circuit boards

The use of integrated resistors and buried capacitance in high performance telecom printed circuit boards

A new cost-effective TAB technology for small and medium volumes

Interconnection technology for advanced high density thick films

Photoimageable Thick Films for Multichip Modules

Samenwerking industrie-universiteit helpt de EMC-materie te ontmaskeren

Failure mechanisms in dielectrics

Karakterisatie van PECVD siliciumnitride en toepassing als totale passivatielaag voor chips

Evaluation of PCVD Silicon Nitride as a Total Passivation Layer for Chips.

P.C.V.D. SIN Conformal Coatings for the Improvement of the Reliability of Wire Bonded Chips.

A comparison between silicon-nitride films made by PCVD of N2-SiH4/Ar and N2-SiH4/He

Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.

Plhoto-imageable thick films for multichipmodules. International Conference on electronic Technologies, pp. 41-45, Windsor, 1994.

Fabrication of High Density Multi-Chip Modules with Standard IC Production Equipment. Hybrid Circuits, Nr. 30, pp. 27-30, 1993.

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