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Photovia technology: Some important aspects for reliability
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Photovia technology: Some important aspects for reliability.
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The realisation of photo-via technology using multiposit as a photo imageable dielectric
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Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly
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Development of an adhesive TAB joining technology
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Interconnection Technology for Advanced High density Thick Films
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Radiated emission of PCB tracks.
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Characterization of integrated resistors for broadband telecom printed circuit boards
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The use of integrated resistors and buried capacitance in high performance telecom printed circuit boards
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A new cost-effective TAB technology for small and medium volumes