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Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages
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Standard SMT process for flip-chip assembly on FR4 substrate
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Photovia technology : some important aspects for reliability
(1999) 1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS. In Proceedings of SPIE 3906. p.240-245 -
Mixed component integration in advanced printed wiring boards
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Mixed component integration in MCM-L technology
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Simulation and measurement of multiplication in thin-film electroluminescent devices with doped probe layers
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UV induced charge transfer and light emission in ZnS based electroluminescent devices with probe layers
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Properties of charge carriers in ZnS and their effect on the excitation of Mn
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Experimental investigation of currents and efficiencies in SrS:Ce thin-film electroluminescent devices
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Onderzoek van het ladingstransport en de efficiëntie van activatorexcitatie in dunne film elektroluminescente cellen
(1996)