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Standard SMT process for flip-chip assembly on FR4 substrate
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Photovia technology: Some important aspects for reliability
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Photovia technology: Some important aspects for reliability.
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Mixed component integration in advanced printed wiring boards
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UV induced charge transfer and light emission in ZnS based electroluminescent devices with probe layers
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Properties of charge carriers in ZnS and their effect on the excitation of Mn
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Onderzoek van het ladingstransport en de efficiëntie van activatorexcitatie in dunne film elektroluminescente cellen
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Optimisation of the design of a discrete CdSe-FLC OASLM
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Ageing of evaporated and ALE AC thin-film electroluminescent devices
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Characterisation of SrS TFEL Devices with CeC13 Doped Probe Layers