Academic Bibliography

Search 200 years of publications by Ghent University researchers.

Stefaan Sercu

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- Journal Article
- A1
Modeling complex via hole structures.

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2002) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 25(2). p.206-214
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- Conference Paper
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Modelling complex via hole structures

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2001) ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING. p.149-152
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- Journal Article
- A1
Modeling differential via holes.

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2001) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 24(3). p.357-363
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- Conference Paper
- C1
Modelling complex via hole structures.

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2001) Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA. p.149-152
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- Conference Paper
- P1
Modelling differential via holes

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2000) ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING. p.127-130
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- Conference Paper
- C1
Modelling differential via holes.

Eric Laermans (UGent) , Jan De Geest, Daniël De Zutter (UGent) , Femke Olyslager (UGent) , Stefaan Sercu and D MORLION

(2000) Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2000), 23-25 October 2000, Scottsdale, Arizona, USA. p.127-130
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A signal integrity design tool for system interconnects.

Eric Laermans (UGent) , Jan De Geest, Femke Olyslager (UGent) , Daniël De Zutter (UGent) , Stefaan Sercu and D MORLION

(2000) Proceedings of the 4th European Symposium on Electromagnetic Compatibility, Vol. 1, 11-15 September 2000, Brugge, Belgium. p.655-658
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- Conference Paper
- C1
Parameter extraction for circuit models of electronic packages without optimization.

Luc Martens (UGent) and Stefaan Sercu

(1999) Proceedings of the IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging, 25-27 October 1999, San Diego, California, USA. p.71-74
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Determination of the optimal signal/ground configuration of a multi-pins connector for minimal crosstalk.

Stefaan Sercu and Luc Martens (UGent)

(1998) ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING. p.21-24
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- Conference Paper
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Multiport measurements

Luc Martens (UGent) and Stefaan Sercu

(1998) (Invited) 1998 IEEE MTT-S International Microwave Symposium - CAD, EM Modeling and Measurement for Electronics Packaging and Interconnects (Workshop), 8 June Baltimore, USA. p.66-75

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