Laura Van Messem

Journal Article
A1
open access

Compact, broadband GCPW-to-AFSIW transition with enhanced PCB integration via stencil-based assembly

Bram Hoflack (UGent) , Samuel Rimbaut (UGent) , Laura Van Messem, Olivier Caytan (UGent) , Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2026) IEEE ACCESS. 14. p.54812-54827

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Journal Article
A1
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Compact self-shielding components for beamforming networks implemented in substrate integrated coaxial line technology

Laura Van Messem, Arno Moerman (UGent) , Olivier Caytan (UGent) , Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2025) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 15(1). p.15-21

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Conference Paper
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Substrate-integrated coaxial line fed air-filled SIW antenna for the 28 GHz 5G bands

Laura Van Messem, Arno Moerman (UGent) , Olivier Caytan (UGent) , Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2024) 2024 54TH EUROPEAN MICROWAVE CONFERENCE, EUMC 2024. In European Microwave Conference p.453-456

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PhD Thesis

Advanced antenna system design based on packaged components for next-generation communication applications

Laura Van Messem

(2024)

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Conference Paper
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Consistent and cost-effective PCB-based D-band air-filled substrate-integrated-waveguide filters

Laura Van Messem, Reinier Broucke (UGent) , Hendrik Rogier (UGent) , Siddhartha Sinha, Ilja Ocket, Heinrich Trischler, Erich Schlaffer, Daniel Schlick and Sam Lemey (UGent)

(2024) 2024 IEEE INTERNATIONAL MICROWAVE FILTER WORKSHOP, IMFW. p.167-169

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Conference Paper
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open access

Packaged cost-effective millimeterwave air-filled SIW components for array feed networks

Laura Van Messem, Arno Moerman (UGent) , Olivier Caytan (UGent) , Dries Vande Ginste (UGent) , Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2023) IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS, EDAPS 2023. In Electrical Design of Advanced Packaging and Systems Symposium

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Conference Paper
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Substrate integrated coaxial line millimeterwave components manufactured in standard PCB

Laura Van Messem, Arno Moerman (UGent) , Olivier Caytan (UGent) , Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2023) 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS

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Journal Article
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Air-filled SIW technology for mass-manufacturable and energy-efficient terahertz systems

Laura Van Messem, Siddhartha Sinha, Ilja Ocket, Heinrich Trischler, Erich Schlaffer, Daniel Schlick, Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2023) SCIENTIFIC REPORTS. 13(1).

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Cost-effective and power-efficient beamforming remote antenna units for millimeterwave distributed antenna systems

Olivier Caytan (UGent) , Arno Moerman (UGent) , Laura Van Messem, Kamil Yavuz Kapusuz (UGent) , Bram Hoflack (UGent) , Igor Lima de Paula, Joris Van Kerrebrouck (UGent) , Guy Torfs (UGent) , Piet Demeester (UGent) , Sam Lemey (UGent) , et al.

(2023) 2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS). p.1-4

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System-level simulation suite for the design of mmWave-over-fiber-based distributed antenna systems

Arno Moerman (UGent) , Olivier Caytan (UGent) , Laura Van Messem, Joris Van Kerrebrouck (UGent) , Guy Torfs (UGent) , Piet Demeester (UGent) , Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2023) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 71(12). p.5082-5094

Academic Bibliography

Laura Van Messem

Compact, broadband GCPW-to-AFSIW transition with enhanced PCB integration via stencil-based assembly

Compact self-shielding components for beamforming networks implemented in substrate integrated coaxial line technology

Substrate-integrated coaxial line fed air-filled SIW antenna for the 28 GHz 5G bands

Advanced antenna system design based on packaged components for next-generation communication applications

Consistent and cost-effective PCB-based D-band air-filled substrate-integrated-waveguide filters

Packaged cost-effective millimeterwave air-filled SIW components for array feed networks

Substrate integrated coaxial line millimeterwave components manufactured in standard PCB

Air-filled SIW technology for mass-manufacturable and energy-efficient terahertz systems

Cost-effective and power-efficient beamforming remote antenna units for millimeterwave distributed antenna systems

System-level simulation suite for the design of mmWave-over-fiber-based distributed antenna systems

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