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Accelerated hermeticity testing of biocompatible moisture barriers used for the encapsulation of implantable medical devices
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Development of an active high-density transverse intrafascicular micro-electrode probe
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FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
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- Journal Article
- A1
- open access
Ultra-long-term reliable encapsulation using an atomic layer deposited Hfo2/Al2o3/Hfo2 triple-interlayer for biomedical implants
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3D multifunctional composites based on large-area stretchable circuit with thermoforming technology
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- Conference Paper
- C3
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Accelerated hermeticity testing of biocompatible moisture barriers used for encapsulation of implantable medical devices
(2017) p.1-1 -
Surface modification of an epoxy resin with polyamines and polydopamine: adhesion towards electroless deposited copper
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Surface modification of an epoxy resin with polyamines and polydopamine: the effect on the initial electroless copper deposition