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- Conference Paper
- C3
- open access
Adhesion test for UTCP structure in humid environment
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- Conference Paper
- C3
- open access
Parylene C for hermetic and flexible encapsulation of interconnects and electronic components
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- Conference Paper
- P1
- open access
Embedding thinned chips in flexible PCBs
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- Conference Paper
- C1
- open access
High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
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A Reliable and comfortable package for wearable medical devices