Nivesh Mangal
- ORCID iD
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0000-0002-7211-8847
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- Journal Article
- A1
- open access
Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling
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- Journal Article
- A1
- open access
Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects
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- Journal Article
- A1
- open access
Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics
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Alignment-tolerant coupling interfaces for board-level integration of silicon photonics
(2020) -
- Journal Article
- A1
- open access
Performance evaluation of backside emitting O-Band grating couplers for 100 μm-thick silicon photonics interposers
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- Conference Paper
- P1
- open access
Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects
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- Conference Paper
- P1
- open access
Alignment-tolerant interfacing of a photonic integrated circuit using back side etched silicon microlenses
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Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
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Packaging and assembly challenges for 50G silicon photonics interposers
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Integration of ball lens in through-package via to enable photonic chip-to-board coupling