Liang Wang
No current affiliation with UGent
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- PhD Thesis
- open access
Design and Technology of Ultra Thin Chip Packages for High-Frequency Applications up to 60 GHz
(2013) -
Self-aligned flat ultra-thin chip package for flexible circuits
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- Conference Paper
- C1
- open access
High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
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Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide
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- Conference Paper
- P1
- open access
An approach to produce a stack of photo definable polyimide based flat UTCPs