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Effect of the shear layer on the etching behavior of 6060 aluminum extrusion alloys
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Fouling-resistant PVDF nanofibre membranes for the desalination of brackish water in membrane distillation
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Dialdehyde carboxymethyl cellulose cross-linked chitosan for the recovery of palladium and platinum from aqueous solution
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Functionalized chitosan adsorbents allow recovery of palladium and platinum from acidic aqueous solutions
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Effect of Zn on the grain boundary precipitates and resulting alkaline etching of recycled Al-Mg-Si-Cu alloys
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Nanoscale intergranular corrosion and relation with grain boundary character as studied in Situ on copper
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Nano-hardness, EBSD analysis and mechanical behavior of ultra-fine grain tungsten for fusion applications as plasma facing material
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Avoiding preferential grain etching in recycled aluminum 6xxx extrusion profiles
(2017) -
Initial stages of intergranular corrosion as studied locally on copper by electrochemical scanning tunneling microscopy
(2017) -
Influence of dipping conditions on intermetallic layer formation and electrochemical behaviour of aluminized steel
(2017) -
Use of local electrochemical methods (SECM, EC-STM) and AFM to differentiate microstructural effects (EBSD) on very pure copper
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Influence of grain size on the electrochemical behavior of pure copper
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Visualization of the correlation between microstructure and corrosion in copper by gold nanoplating
(2016) -
Local passivation of metals at grain boundaries : in situ scanning tunneling microscopy study on copper
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- Journal Article
- A1
- open access
Effective use of transient vibration damping results for non-destructive measurements of fibre-matrix adhesion of fibre-reinforced flax and carbon composites
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Visualization of the correlation between microstructure and corrosion in copper by gold nanoplating
(2016) -
Study of the influence of the microstructure on the corrosion properties of pure copper
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Microstructural characteristics of the corrosion behavior of pure copper
(2015) -
- Conference Paper
- P1
- open access
Texture comparison between cold rolled and cryogenically rolled pure copper
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Grain boundary passivation studied by in situ scanning tunneling microscopy on microcrystalline copper