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- Conference Paper
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Flexible hybrid integration of photonic and electronic chips using aerosol-jet printing
(2017) p.82-85 -
Integrated polymer polarization rotator based on tilted laser ablation
(2017) INTEGRATED OPTICS: DEVICES, MATERIALS, AND TECHNOLOGIES XXI. In Proceedings of SPIE 10106. p.10106C-1-10106C-11 -
Polymer micro- and nanophotonic sensors realized using replication technologies
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- Conference Paper
- C1
- open access
Multi-level optical signal generation using a segmented-electrode InP IQ-MZM with integrated CMOS binary drivers
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Scalable electro-photonic integration concept based on polymer waveguides
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Comparison of epoxy- and siloxane-based single-mode optical waveguides defined by direct-write lithography
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Bragg grating sensors in laser-written single mode polymer waveguides
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Laser processing for large area polymer photonic applications
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- Conference Paper
- P1
- open access
lOptical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL
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Adaptive coupling approach for single mode VCSELs with polymer waveguides
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Polymer integration of optoelectronic devices in on-board and board-to-board optical communication systems
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- Journal Article
- A1
- open access
Stretchable optical waveguides
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- Conference Paper
- P1
- open access
Assembly of optoelectronics for efficient chip-to-waveguide coupling
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Ultra-thin multi-axial shear stress sensor based on a segmented photodiode
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- Conference Paper
- C1
- open access
Board-level single-mode polymer optical waveguides
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Self-written waveguides for field-installable fiber connectors
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- Conference Paper
- C3
- open access
Photonic skins for pressure, shear and strain sensing
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- Conference Paper
- C3
- open access
Optoelectronics packaging for efficient chip-to-waveguide coupling
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Two axis optoelectronic tactile shear stress sensor
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- Journal Article
- A1
- open access
Ultra small integrated optical fiber sensing system
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Fluorescence-based optochemical sensor on flexible foils
(2012) PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING. 8439(0Y-1). p.84390Y-1-84390Y-9 -
Compact coupling and packaging concepts for flexible and stretchable polymer optical interconnects
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Photonic incremental pressure sensor based on optical feedback in a Polymer embedded VCSEL
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Low-cost fully integrated fiber Bragg grating interrogation system
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Novel coupling and packaging approaches for optical interconnects
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Foil-based optical technology platform for optochemical sensors
(2012) PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING. 8264(0R-1). p.82640R-1-82640R-9 -
Ultra thin optical tactile shear sensor
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- Conference Paper
- P1
- open access
Embedded multiplexed polymer optical fiber sensor for esophageal manometry
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Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors
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Toward flexible optoelectronics packaging
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Ultrathin optoelectronic device packaging in flexible carriers
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Flexible shear sensor based on embedded optoelectronic components
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- Conference Paper
- P1
- open access
Packaging technology enabling flexible optical interconnections
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System-in-foil technology
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- Conference Paper
- P1
- open access
Design and fabrication of embedded micro-mirror inserts for out-of-plane coupling in PCB-level optical interconnections
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UTCP: a novel polyimide-based ultra-thin chip packaging technology
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Fully flexible optoelectronic foil
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- Conference Paper
- P1
- open access
Embedded flexible optical shear sensor
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Optical fiber sensors embedded in polymer flexible foils
(2010) Proceedings of SPIE, the International Society for Optical Engineering. 7726(Optical sensing and detection). -
Characterization of flexible fully embedded optical links
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- PhD Thesis
- open access
Integration of optical interconnections and optoelectronic components in flexible substrates
(2010) -
Packaging of opto-electronic devices for flexible applications
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Embedded high resolution sensor based on optical feedback in a Vertical Cavity Surface Emitting Laser
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Highly reliable flexible active optical links
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Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
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High density optical pressure sensor foil based on arrays of crossing flexible waveguides
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Fabrication processes for embedding thin chips in flat flexible substrates
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- Conference Paper
- P1
- open access
Fully embedded optical and electrical interconnections in flexible foils
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Coupling structures for out-of-plane coupling in optical PCBs
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Towards flexible routing schemes for polymer optical interconnections on Printed Circuit Boards
(2008) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 6897. p.XXXI-XXXVII