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- Journal Article
- A1
- open access
High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages
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- PhD Thesis
- open access
3D-stacking of ultra-thin chips and chip packages
(2013) -
Photo-definable polyimide-based flat UTCP technology for 3D-stacking application
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3D stacking of ultrathin chip packages: an innovative packaging and interconnection technology
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- Conference Paper
- C1
- open access
High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
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- Conference Paper
- P1
- open access
An approach to produce a stack of photo definable polyimide based flat UTCPs
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3D-stacking of UTCPs as a module miniaturization technology
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Module miniaturization by ultra thin package stacking