Academic Bibliography

Search 200 years of publications by Ghent University researchers.

Liang Wang

No current affiliation with UGent

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- PhD Thesis
- open access
Design and Technology of Ultra Thin Chip Packages for High-Frequency Applications up to 60 GHz

Liang Wang (UGent)

(2013)
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Self-aligned flat ultra-thin chip package for flexible circuits

Liang Wang (UGent) , Maarten Cauwe (UGent) , Steven Brebels, Walter De Raedt, and Jan Vanfleteren (UGent)

(2013) CIRCUIT WORLD. 39(4). p.174-180
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- Conference Paper
- C1
- open access
High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Tom Sterken (UGent) , Maaike Op de Beeck (UGent) , Filip Vermeiren (UGent) , Tom Torfs, Liang Wang (UGent) , Swarnakamal Priyabadini (UGent) , Kristof Dhaenens (UGent) , Dieter Cuypers (UGent) and Jan Vanfleteren (UGent)

(2012) IMAPS 2012 : proceedings of the 45th international symposium on microelectronics. p.940-945
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Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

Liang Wang (UGent) , Tom Sterken (UGent) , Maarten Cauwe (UGent) , Dieter Cuypers (UGent) and Jan Vanfleteren (UGent)

(2012) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2(7). p.1099-1106
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- Conference Paper
- P1
- open access
An approach to produce a stack of photo definable polyimide based flat UTCPs

Swarnakamal Priyabadini (UGent) , Tom Sterken (UGent) , Liang Wang (UGent) , Kristof Dhaenens (UGent) , Bjorn Vandecasteele (UGent) , Steven Van Put (UGent) , Andreas Erik Petersen and Jan Vanfleteren (UGent)

(2012) 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC).