Dean's Office of the Faculty of Engineering and Architecture

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2007
- C1
- conference
Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board
T ALAJOKI, Nina Hendrickx UGent, J VAN ERPS, S OBI, M KARPPINEN, Hugo Thienpont UGent, Peter Van Daele UGent and P KARIOJA (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.258-261 Mark
- C1
- conference
Inter-plane coupling structures for PCB-integrated multilayer optical interconnections
Nina Hendrickx UGent, J VAN ERPS, Hugo Thienpont UGent and Peter Van Daele UGent (2007) Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference. p.65-69 Mark
- A1
- journalArticle
Discrete out-of-plane coupling components for printed circuit board-level optical interconnections
J VAN ERPS, Nina Hendrickx UGent, C DEBAES, Peter Van Daele UGent and Hugo Thienpont UGent (2007) IEEE PHOTONICS TECHNOLOGY LETTERS. 19(21-24). p.1753-1755 Mark
- C1
- conference
Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections
J VAN ERPS, Nina Hendrickx UGent, C DEBAES, Peter Van Daele UGent and Hugo Thienpont UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.70-75 Mark
- C1
- conference
Towards low cost coupling structures for short distance optical interconnections
Nina Hendrickx UGent, J VAN ERPS, T ALAJOKI, N DESTOUCHES, D BLANC, J FRANC, P KARIOJA, Hugo Thienpont UGent and Peter Van Daele UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.247-252 Mark
- C1
- conference
Inter-plane coupling structures for pcb-integrated multilayer optical interconnections
N HENDRICKX, J VAN ERPS, Hugo Thienpont UGent and Peter Van Daele UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), Oulu, Finland. p.65-69 Mark
- C1
- conference
Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections
J VAN ERPS, N HENDRICKX, C DEBAES, Peter Van Daele UGent and Hugo Thienpont UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), Oulu, Finland. p.70-75 Mark
- P1
- conference
Efficient and compact illumination in LED projection displays
Bart Van Giel, Youri Meuret, Lawrence Bogaert, Hugo Thienpont UGent, Hüseyin Murat UGent and Herbert De Smet UGent (2007) SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS. 38. p.947-950 Mark
- C1
- conference
Performance Evaluation of Large Reconfigurable Interconnects for Multiprocessor Systems
Wim Heirman, I ARTUNDO, Joni Dambre UGent, C DEBAES, T PHAM DOAN, K BUI VIET, Hugo Thienpont UGent and Jan Van Campenhout UGent (2007) Proceedings of the International Symposium on Electrical - Electronics Engineering (ISEE 2007), HoChiMinh City, Vietnam. p.145-150 Mark
- A1
- journalArticle
Tolerance analysis for multilayer optical interconnections integrated on a printed circuit board
Nina Hendrickx UGent, J VAN ERPS, Geert Van Steenberge UGent, Hugo Thienpont UGent and Peter Van Daele UGent (2007) JOURNAL OF LIGHTWAVE TECHNOLOGY. 25(9). p.2395-2401 Mark

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