Dean's Office of the Faculty of Engineering and Architecture

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2007
- C1
- conference
Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board
T ALAJOKI, Nina Hendrickx UGent, J VAN ERPS, S OBI, M KARPPINEN, Hugo Thienpont UGent, Peter Van Daele UGent and P KARIOJA (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.258-261 Mark
- C1
- conference
Inter-plane coupling structures for pcb-integrated multilayer optical interconnections
N HENDRICKX, J VAN ERPS, Hugo Thienpont UGent and Peter Van Daele UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), Oulu, Finland. p.65-69 Mark
- A1
- journalArticle
Discrete out-of-plane coupling components for printed circuit board-level optical interconnections
J VAN ERPS, Nina Hendrickx UGent, C DEBAES, Peter Van Daele UGent and Hugo Thienpont UGent (2007) IEEE PHOTONICS TECHNOLOGY LETTERS. 19(21-24). p.1753-1755 Mark
- C1
- conference
Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections
J VAN ERPS, Nina Hendrickx UGent, C DEBAES, Peter Van Daele UGent and Hugo Thienpont UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.70-75 Mark
- C1
- conference
Towards low cost coupling structures for short distance optical interconnections
Nina Hendrickx UGent, J VAN ERPS, T ALAJOKI, N DESTOUCHES, D BLANC, J FRANC, P KARIOJA, Hugo Thienpont UGent and Peter Van Daele UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.247-252 Mark
- C1
- conference
Inter-plane coupling structures for PCB-integrated multilayer optical interconnections
Nina Hendrickx UGent, J VAN ERPS, Hugo Thienpont UGent and Peter Van Daele UGent (2007) Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference. p.65-69 Mark
- A1
- journalArticle
Tolerance analysis for multilayer optical interconnections integrated on a printed circuit board
Nina Hendrickx UGent, J VAN ERPS, Geert Van Steenberge UGent, Hugo Thienpont UGent and Peter Van Daele UGent (2007) JOURNAL OF LIGHTWAVE TECHNOLOGY. 25(9). p.2395-2401 Mark
- C1
- conference
Integration of optical interconnections on circuit board (invited paper)
M KARPPINEN, T ALAJOKI, P KARIOJA, Nina Hendrickx UGent, Geert Van Steenberge UGent, Peter Van Daele UGent, J VAN ERPS, C DEBAES, Hugo Thienpont UGent, S OBI, et al. (2007) 13th MicroOptics Conference (MOC'07). p.94-97 Mark
- C1
- conference
Performance Evaluation of Large Reconfigurable Interconnects for Multiprocessor Systems
Wim Heirman, I ARTUNDO, Joni Dambre UGent, C DEBAES, T PHAM DOAN, K BUI VIET, Hugo Thienpont UGent and Jan Van Campenhout UGent (2007) Proceedings of the International Symposium on Electrical - Electronics Engineering (ISEE 2007), HoChiMinh City, Vietnam. p.145-150 Mark
- C1
- conference
Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections
J VAN ERPS, N HENDRICKX, C DEBAES, Peter Van Daele UGent and Hugo Thienpont UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), Oulu, Finland. p.70-75 Mark

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